Kenosistec designed the Horizontal sputtering systems of the KS-HR family to enhance , improved film uniformity ,process versatility.
There features make them the ideal tools for R&D ACTIVITIES and process development. A full range of options is available to optimize their performances for special applications.
Thin film structures of metals, oxides for Aerospace, Microelectronics, Sensors, Automotive, Optics and Energy.
Sputter up or sputter down
All the KS Horizontal models include automatic handling of the substrate holder. Substrate rotation to improve deposition uniformity. Load lock with optional parking device is included. Optional devices for substrate heating or cooling are available.
Sequential or Confocal capability Circular cathodes from 1” to 10”
p to 5 independent MFC’s with individual shut off valve. Upstream and downstream pressure control.
The process and system controller is composed by a PLC and a PC. The process controller directly operates all system components under supervision of the system controller.
System is fully automatic and each chamber is independent and processes can be run simultaneously in all the chambers.